Active Thermal Management
for High-Speed Wireless Charging

Reference design and samples available for up to 40W of cooling in custom form factors

Active Thermal Management
That is Silent

Reference design and samples available for ultra-thin form factors
that cannot implement axial fans

Active Thermal Management
and In-Cabin Wireless Charging

Reference design and samples available with ODM partner

Active Thermal Management
with No Vibration

Technology white paper and samples available showing new,
ground-breaking ways remove heat from constrained environments

Active Thermal Management
in Flexible Form Factors

Enabling new form factors to be envisioned by OEM designers.
Practical for modern, ultra thin & lightweight electronic devices

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Active Thermal Management for
High-Speed Wireless Charging

Reference design and samples available for up to 40W of cooling in custom form factors

Active Thermal Management
That is Silent

Reference design and samples available for ultra-thin form factors
that cannot implement axial fans

Active Thermal Management
and In-Cabin
Wireless Charging

Reference design and samples available with ODM partner

Active Thermal Management with
No Vibration

Technology white paper and samples available showing new,
ground-breaking ways remove heat from constrained environments

Active Thermal Management in
Flexible Form Factors

Enabling new form factors to be envisioned by OEM designers.
Practical for modern, ultra thin & lightweight electronic devices

Previous slide

Next slide

Active Thermal Management for High-Speed Wireless Charging

Reference design and samples available for up to 40W of cooling in custom form factors

Active Thermal Management
That is Silent

Reference design and samples available for ultra-thin form factors that cannot implement axial fans

Active Thermal Management
and In-Cabin
Wireless Charging

Reference design and samples available with ODM partner

Active Thermal Management with No Vibration

Technology white paper and samples available showing new,
ground-breaking ways remove heat from constrained environments

Active Thermal Management in Flexible Form Factors

Enabling new form factors to be envisioned by OEM designers.
Practical for modern, ultra thin & lightweight electronic devices

Previous slide

Next slide

The Ventiva™ active thermal management solution, ICE, is a ground breaking advance over the previous cooling technologies used in electronic devices. The ICE™ technology roadmap from Ventiva spans numerous form factors ranging from stand-alone mounted solutions to integrated PCB surface mount implementations. All are ultra-small and can be designed in with conventional tooling by Ventiva-authorized ODM partners. Proof-of-concept projects are underway, and samples are available for qualified OEM companies.

Active Thermal Management for the
Digital Age

Ground-breaking active thermal management technology

First new commercial thermal management architecture to be introduced in decades

Founded on fundamental R&D on “Electro-Hydrodynamic Flow”

Next-generation devices require more from active thermal management systems than current solutions can provide. Ventiva’s ICE™ architecture enables digital designs with:

A whole system design methodology
Custom form factor & embeddability
Ultra-small size
No moving parts
Silent operation
Intelligence
Simple integration into PCB manufacturing flows

Using the principle of “electro-hydrodynamic flow,” a tiny plasma field is created which throws off positive ions. The ions move across a small gap, colliding with air molecules onto a collector resulting in efficient, silent airflow.