Ventiva Secures $33M in Oversubscribed Funding Round to Scale ICE9: Next-Gen Silent, AI-Enabled Cooling for Laptops

Ventiva’s groundbreaking ICE9™ technology redefines thermal management, solving critical cooling issues for today’s ultra-thin, high-performance devices.

Ventiva®, the leader in thermal solutions, today announced the close of $33 million in funding led by IAG Capital Partners. This funding enables Ventiva to accelerate the production of ICE9, an innovative, silent cooling solution designed to meet the demands of ultra-thin, AI-powered laptops as heat generation and noise challenges test industry design limits.

“We sincerely appreciate this vote of confidence from our investors; it will help us ramp production of our groundbreaking ICE9 thermal management system to accelerate the adoption of our technology at multiple OEMs simultaneously as we scale up our hiring,” said Carl Schlachte, CEO, Chairman, and Director of Ventiva.

Commenting on the financing, Dennis Sacha, partner at IAG, said, “Having seen the breadth of Ventiva’s customer design wins and based on our analysis that ICE9 is the only thermal technology with the performance and scale to enable truly silent thin computing across all notebook computers, we believe that the end has come for laptop fans. We’re excited to help Ventiva as they seize this moment.”

The investment will accelerate Ventiva’s hiring and manufacturing capacity, preparing us to scale in 2025. Furthermore, the funding will advance our next-generation ICE technology, specifically designed for handsets and wearables.

About Ventiva
Ventiva, a leading company in active cooling solutions for electronic devices, enables thinner, faster, and cooler high-performance devices that are lightweight, silent, and vibration-free. The company’s patented ICE® technology is a pioneering all-electronic heat transfer technology created to address the thermal problems exacerbated by modern high-performance semiconductor design.

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