Active Thermal Management
for High-Speed Wireless Charging
Reference design and samples available for up to 40W of cooling in custom form factors
Active Thermal Management
That is Silent
Reference design and samples available for ultra-thin form factors
that cannot implement axial fans
Active Thermal Management
and In-Cabin Wireless Charging
Reference design and samples available with ODM partner
Active Thermal Management
with No Vibration
Technology white paper and samples available showing new,
ground-breaking ways remove heat from constrained environments
Active Thermal Management
in Flexible Form Factors
Enabling new form factors to be envisioned by OEM designers.
Practical for modern, ultra thin & lightweight electronic devices
Previous
Next
Active Thermal Management for
High-Speed Wireless Charging
Reference design and samples available for up to 40W of cooling in custom form factors
Active Thermal Management
That is Silent
Reference design and samples available for ultra-thin form factors
that cannot implement axial fans
Active Thermal Management
and In-Cabin
Wireless Charging
Reference design and samples available with ODM partner
Active Thermal Management with
No Vibration
Technology white paper and samples available showing new,
ground-breaking ways remove heat from constrained environments
Active Thermal Management in
Flexible Form Factors
Enabling new form factors to be envisioned by OEM designers.
Practical for modern, ultra thin & lightweight electronic devices
Previous
Next
Active Thermal Management for High-Speed Wireless Charging
Reference design and samples available for up to 40W of cooling in custom form factors
Active Thermal Management
That is Silent
Reference design and samples available for ultra-thin form factors that cannot implement axial fans
Active Thermal Management
and In-Cabin
Wireless Charging
Reference design and samples available with ODM partner
Active Thermal Management with No Vibration
Technology white paper and samples available showing new,
ground-breaking ways remove heat from constrained environments
Active Thermal Management in Flexible Form Factors
Enabling new form factors to be envisioned by OEM designers.
Practical for modern, ultra thin & lightweight electronic devices
Previous
Next
Prototype of the Ventiva™ active thermal management solution, which is beside a paperclip to show how small the devices, which is a ground breaking advance over the previous cooling technologies used in electronic devices with airflow flowing through

The Ventiva™ active thermal management solution, ICE, is a ground breaking advance over the previous cooling technologies used in electronic devices.  The ICE™ technology roadmap from Ventiva spans numerous form factors ranging from stand-alone mounted solutions to integrated PCB surface mount implementations.  All are ultra-small and can be designed in with conventional tooling by Ventiva-authorized ODM partners.  Proof-of-concept projects are underway, and samples are available for qualified OEM companies.

Active Thermal Management for the
Digital Age

Ground-breaking active thermal management technology

First new commercial thermal management architecture to be introduced in decades

Founded on fundamental R&D on “Electro-Hydrodynamic Flow”

Next-generation devices require more from active thermal management systems than current solutions can provide. Ventiva’s ICE™ architecture enables digital designs with:

Using the principle of “electro-hydrodynamic flow,” a tiny plasma field is created which throws off positive ions.  The ions move across a small gap, colliding with air molecules onto a collector resulting in efficient, silent airflow.  

Venn Diagram with four circles, and Ventiva logo is in the middle crossing all four circles. The circles are Highly Embeddable, Smart Airflow, Air Convection at The Heat Source and Solid State Design
Graphic to demonstrate how Ventiva ICE technology devices use the principle of “electro-hydrodynamic flow,” a tiny plasma field is created which throws off positive ions. The ions move across a small gap, colliding with air molecules onto a collector resulting in efficient, silent airflow.

Active Thermal Management
for the Digital Age

Ground-breaking active thermal management technology

First new commercial thermal management architecture to be introduced in decades

Founded on fundamental R&D on “Electro-Hydrodynamic Flow”

Next-generation devices require more from active thermal management systems than current solutions can provide. Ventiva’s ICE™ architecture enables digital designs with:

Using the principle of “electro-hydrodynamic flow,” a tiny plasma field is created which throws off positive ions.  The ions move across a small gap, colliding with air molecules onto a collector resulting in efficient, silent airflow.  

Venn Diagram with four circles, and Ventiva logo is in the middle crossing all four circles. The circles are Highly Embeddable, Smart Airflow, Air Convection at The Heat Source and Solid State Design
Graphic to demonstrate how Ventiva ICE technology devices use the principle of “electro-hydrodynamic flow,” a tiny plasma field is created which throws off positive ions. The ions move across a small gap, colliding with air molecules onto a collector resulting in efficient, silent airflow.

Active Thermal Management for the Digital Age

Ground-breaking active thermal management technology

First new commercial thermal management architecture to be introduced in decades

Founded on fundamental R&D on “Electro-Hydrodynamic Flow”

Next-generation devices require more from active thermal management systems than current solutions can provide. Ventiva’s ICE™ architecture enables digital designs with:

Using the principle of “electro-hydrodynamic flow,” a tiny plasma field is created which throws off positive ions.  The ions move across a small gap, colliding with air molecules onto a collector resulting in efficient, silent airflow.  

Venn Diagram with four circles, and Ventiva logo is in the middle crossing all four circles. The circles are Highly Embeddable, Smart Airflow, Air Convection at The Heat Source and Solid State Design
Graphic to demonstrate how Ventiva ICE technology devices use the principle of “electro-hydrodynamic flow,” a tiny plasma field is created which throws off positive ions. The ions move across a small gap, colliding with air molecules onto a collector resulting in efficient, silent airflow.

Trends of Next Generation Applications
Enabled by Ventiva ICE™ Technology

Trends of Next Generation Applications
Enabled by Ventiva ICE™ Technology

Wireless Charging Pads will be a future application for Ventiva Ice Technology Thermal Management
Wireless Charging Pads
IoT Devices such as security cameras, VR goggles and Smart Speakers, will be a future applications for Ventiva ICE Technology Thermal Cooling Management
IoT Devices
Laptops will be a future application for Ventiva ICE Technology Thermal Management with ventless and cordless models
Laptops
Wireless Car Charging Station will be a future application for Ventiva ICE Technology Thermal Cooling Management
Automotive
Tablets will be a future application for Ventiva ICE Technology Thermal Management
Tablets
HD TVs will be a future application for Ventiva ICE Technology Thermal Management
HD TVs

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